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| Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification UHPT722 SSC Drawn Ap v al pro i Ap v al pro 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet CONTENTS 1. Feature & Application 2. Absolute M aximu Ratings m 3. Electr Char ct o a eristic s 4. 5. 6. 7. 8. 9. Optical charact eristics Rank UHPT 22 of 7 Outline Dimension Packing L number ot Soldering 10. P recaution for use 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Technical Data Sheet UHPT722 Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40E to 100E . The high reliability feature is crucial to Automotive interior and Indoor ESS. UHPT722 Features * Pb-free Reflow Soldering application * RoHS Compliant * Material:AlGaInP/GaP * Suitable for all SMT assembly methods ; Suitable for all soldering methods * White colored SMT package and colorless clear window * Encapsulating Resin : Epoxy Resin Applications * Indoor and outdoor displays * LCD Backlights etc. * Red - displays * Automotive * Signage and Channel letter * Indicator 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM *2 Value 234 90 100 5 -30 ~ +85 -40 ~ +100 Unit mW mA mA V C C VR Topr Tstg *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW A 1msec of pulse width and D A 1/10 of duty ratio. 3. Electric & Optical characteristics Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity Luminance Flux Dominant Wavelength Peak Wavelength Spectral Bandwidth Viewing Angle *2 *1 Sym bol VF IR IV V Condition IF =20 mA VR=5V IF =60 mA IF =60 mA IF =60 mA IF =60mA IF =60 mA IF =60 mA IF =60 mA Min - Typ 2.2 1000 Max 2.8 10 Unit V A mcd 618 - 3 630 640 20 120 23 363 - lm nm nm nm deg lm/W d P 21/2 opt Optical Efficiency *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 3/4 10% *2. 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Forward Current IF[mA] Relative Luminous Intensity IV/IV(25 C)[a.u.] o Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Current vs. Forward Voltage (per die) (Ta=25 OC ) 100 50 20 10 5 1 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 Forward Voltage VF[V] Relative Luminous Intensity vs Forward Current (Ta=25 OC ) 6 5 4 3 2 1 0 0 30 (10) 60 (20) 90 (30) 120 (40) 150 (50) 180 (60) 210 (70) 240 (80) 270 300 < total (90) (100)< per die Forward Current IF[mA] 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Foward Current IF[mA] Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Ambient Temperature vs. Allowable Forward Current (per die) (Ta=25 OC ) 40 3 Chip ON 30 20 10 0 0 20 40 60 o 80 100 Ambient Temperature TA[ C] Radiation Diagram 0 -30 30 -60 60 -90 90 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet A 5. Rank of UHPT722 A Rank Name Table X1 IV X2 e d X3 Vf Luminous Intensity [mcd] Rank Name N O P Q A MIN 350 650 880 1200 MAX 650 880 1200 1700 Dominant Wavelength [nm] Rank Name A B C MIN 618 624 630 MAX 624 630 636 A Forward Voltage [V] Rank Name 1 2 3 MIN 1.9 2.2 2.4 MAX 2.2 2.4 2.6 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6.outline dimension Package Outlines 6 5 4 Package Marking (Cathode) 1 2 3 Front View Right View Rear View ( Tolerance: 3/4 0.2, Unit: mm ) Circuit Diagram Red Anode 6 Recommended Solder Pad Red Anode 5 Red Anode 4 R1 1 R2 2 R3 3 Red Cathode Red Cathode Red Cathode * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 7. packing Package Marking ( Tolerance: 3/4 0.2, Unit: mm ) 1)Quantity : 700pcs/Reel 2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 3/4 0.2mm 3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape 4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet UR eel P ack ing S tru ctu re Reel RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXX XXXX XX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXX XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXX XXXXXX RoHS c 1 b SEOUL SEMICONDUCTOR CO., LTD. a 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. lot number The lot number is composed of the following characters; UHPTYaU #~# UHPT -First Part Name U - Year (6 for 2006, 7 for 2007, 8 for 2008 ) a - Month ( 01 for Jan., 02 for Feb., 11 for Nov., 12 for Dec.) Y - Day ( 01, 02, 03, 04, 28, 29, 30, 31.) # ~# - The number of the internal quality control XXX QUANTITY : 700 LOT NUMBER : UHPT70426 01 512 PART NUMBER : UHPT722 SEOUL SEMICONDUCTOR CO., LTD. 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 9. soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Tempera re tu Sold ering time Cond ition 120 150E ~ 120 sec. Max. 240 Max E . 10 s ec. Max. 2.5~5 C / sec. 2.5~5 o C / sec. 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC Pre-heating 120~150 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder Lead F ree Solder Pre-heat Pre-heat time Peak-Tempera re tu Sold ering time Cond ition 150 200E ~ 120 sec. Max. 260 Max E . 10 s ec. Max. 1~5 o C / sec. 1~5 o C / sec. 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC Pre-heating 150~200 o C 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315C under soldering iron. Note : In case that the soldered products are reused in soldering process, we don't guarantee the products. 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 603/4 5C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. 1/4-1/2AoE : SSC-QP-7-07-24 ev.00) (R |
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